Osaka Heat Cool
Funding Series
Seed
Funding Amount
¥10m
[data from INITIAL 2024 Dec]
Healthcare/Medtech VR/AR & Metaverse

About

With the aim of “hacking the five senses using temperature,” the company is conducting research a​nd development of new products centered on thermal tactile technology.

Milestone

Osaka Heat Cool plans to complete the development of its itch relief device—which uses thermal tactile technology to reduce itching—by April 2025. After that, it will aim to expand, including through overseas expansion, and pursue an IPO in 2029.
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